In key electronic applications such as data centers, automotive, and 5G, data speed and volume are increasing at an exponential rate. Data centers require data transmission (Figure 1) of up to 112 Gbps, which can only be achieved using PAM4 signaling. The automotive industry faces the challenges of transferring data between various electronic control units (ECUs) at very high data speed reaching gigabits per second, primarily over two pairs of wires, while struggling to manage impedance. In 5G, the amount of data that needs to be processed at edge nodes and data centers is huge. Devices must be equipped to handle these speeds and make timely control decisions.
One of the critical challenges facing the semiconductor industry is maintaining data integrity as demand for bandwidth increases, which puts a strain on server, storage, and network bandwidth. existing cloud data center network infrastructure. The main cutting-edge technologies for these bottlenecks are system-level signal and power integrity (SI/PI), which require modeling and simulation of the various interconnect parts used before manufacturing the system. An example is the supply of power throughout the system, usually via high-speed connectors and cables, which requires interconnect modeling and simulation and necessitates a next-generation 3D field solver. These challenges are no longer a single board problem or a single case problem, but a problem for the entire Rigid-Flex design.
We detail a tool for semiconductor and systems companies to design robust applications, addressing complex EM challenges involving complex 5G and 112G communication networks and advanced driver assistance systems (ADAS), HPC , machine learning (ML) and Internet of Things (IoT) applications with benchmark accuracy.
Click here to read more.
